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- Corneliu N. ColesniucSenior Process Engineer, IntelVerified email at intel.com
- Ivan K. SchullerUC San DiegoVerified email at ucsd.edu
- Xinyu BaoTSMCVerified email at tsmc.com
- Cesare SociAssociate Professor, Nanyang Technological UniversityVerified email at ntu.edu.sg
- Deli WangUC Santa Barbara, Harvard University, UC San Diego, NEEM ScientificVerified email at neem-scientific.com
- Amos SharoniDepartment of Physics, Bar Ilan UniversityVerified email at biu.ac.il
- Cary Y YangProfessor of Electrical and Computer Engineering, Santa Clara UniversityVerified email at scu.edu
- Thomas GredigCalifornia State University Long BeachVerified email at csulb.edu
- Manuel E. RuidiazImaging and Analysis ScientistVerified email at sanfordburnham.org
- Li-Han ChenU. of California, San DiegoVerified email at ucsd.edu
- Anshul VyasVerified email at scu.edu
- Yoon Kee KimHanbat National UniversityVerified email at hanbat.ac.kr
- Toshishige YamadaResearch Professor at Santa Clara Univ: UC Santa Cruz, NASA Ames, Arizona State UnivVerified email at scu.edu
- Chiara DaraioCalifornia Institute of TechnologyVerified email at caltech.edu
- Geun-Young YeomSungkyunkwan UniversityVerified email at skku.edu
- Jingjing XuDepartment of Chemical Engineering, Massachusetts Institute of TechnologyVerified email at alum.mit.edu
- Sangyeob LeeAssociate Professor, Dept. of Materials Science and Engineering, Hanbat National UniversityVerified email at hanbat.ac.kr
- Chulmin ChoiNANOSD, INC.Verified email at nano-sd.com
- Ashish AgrawalDevcie Engineer at Components Research, Intel CorporationVerified email at intel.com
- Suman DattaJoseph M. Pettit Chair ProfessorVerified email at gatech.edu
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Jeongwon Park (JP)
Electrical and Biomedical Engineering, University of Nevada Reno, USA, EECS, uOttawa, Canada
Verified email at unr.edu - Homepage