Christopher M. Gourlay

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Sergey BelyakovTokamakenergy, UKVerified email at tokamakenergy.co.uk
Kazuhiro NogitaProfessor of Materials Engineering, The University of QueenslandVerified email at uq.edu.au
Hideyuki YasudaKyoto UniversityVerified email at kyoto-u.ac.jp
Jingwei XianDalian University of TechnologyVerified email at dlut.edu.cn
Guang ZengCentral South University, ChinaVerified email at csu.edu.cn
Z.L. MaBeijing Institute of TechnologyVerified email at bit.edu.cn
Catherine O'SullivanProfessor of Particulate Soil Mechanics, Imperial College LondonVerified email at imperial.ac.uk
Mohd Arif Anuar Mohd SallehUniversity Malaysia PerlisVerified email at unimap.edu.my
Ben BrittonDepartment of Materials Engineering, University of British ColumbiaVerified email at ubc.ca
Te-Cheng SuNational Taiwan UniversityVerified email at ntu.edu.tw
Yilun Xu (徐轶伦)IHPC, A*STAR/Imperial College LondonVerified email at ihpc.a-star.edu.sg
Liuqing PengImperial College LondonVerified email at imperial.ac.uk
FPE DunneImperial CollegeVerified email at imperial.ac.uk
Minh-Son PhamImperial College LondonVerified email at imperial.ac.uk
Peter D LeeRoyal Academy of Engineering Chair in Emerging Technologies, University College LondonVerified email at ucl.ac.uk
Yi CuiImperial College LondonVerified email at imperial.ac.uk
Lang YUANUniversity of South CarolinaVerified email at cec.sc.edu
Stoyan StoyanovProfessor in Computational Engineering, University of Greenwich, London, UKVerified email at gre.ac.uk
Phromphong PandeeDepartment of Production Engineering, King Mongkut's University of Technology ThonburiVerified email at kmutt.ac.th
Cheng-Jung LinImperial College LondonVerified email at ic.ac.uk

Christopher M. Gourlay

Department of Materials, Imperial College London

Verified email at imperial.ac.uk - Homepage

metallurgy solidification phase transformations microstructure intermetallics


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The role of side-branching in microstructure development in laser powder-bed fusion MS Pham, B Dovgyy, PA Hooper, CM Gourlay, A Piglione Nature communications 11 (1), 749, 2020	401	2020
Dilatant shear bands in solidifying metals CM Gourlay, AK Dahle Nature 445 (7123), 70-73, 2007	262	2007
Printability and microstructure of the CoCrFeMnNi high-entropy alloy fabricated by laser powder bed fusion A Piglione, B Dovgyy, C Liu, CM Gourlay, PA Hooper, MS Pham Materials Letters 224, 22-25, 2018	186	2018
Cracking and phase stability in reaction layers between Sn-Cu-Ni solders and Cu substrates K Nogita, CM Gourlay, T Nishimura Jom 61, 45-51, 2009	164	2009
Defect band characteristics in Mg-Al and Al-Si high-pressure die castings CM Gourlay, HI Laukli, AK Dahle Metallurgical and Materials Transactions A 38, 1833-1844, 2007	160	2007
Microstructure formation in AlSi4MgMn and AlMg5Si2Mn high-pressure die castings S Otarawanna, CM Gourlay, HI Laukli, AK Dahle Metallurgical and Materials Transactions A 40, 1645-1659, 2009	134	2009
Migration of crystals during the filling of semi-solid castings HI Laukli, CM Gourlay, AK Dahle Metallurgical and Materials Transactions A 36, 805-818, 2005	124	2005
Revealing the micromechanisms behind semi-solid metal deformation with time-resolved X-ray tomography KM Kareh, PD Lee, RC Atwood, T Connolley, CM Gourlay Nature communications 5 (1), 4464, 2014	110	2014
Cu6Sn5 crystal growth mechanisms during solidification of electronic interconnections JW Xian, SA Belyakov, M Ollivier, K Nogita, H Yasuda, CM Gourlay Acta Materialia 126, 540-551, 2017	104	2017
Granular deformation mechanisms in semi-solid alloys CM Gourlay, AK Dahle, T Nagira, N Nakatsuka, K Nogita, K Uesugi, ... Acta Materialia 59 (12), 4933-4943, 2011	102	2011
Direct observation of deformation in semi-solid carbon steel T Nagira, CM Gourlay, A Sugiyama, M Uesugi, Y Kanzawa, M Yoshiya, ... Scripta Materialia 64 (12), 1129-1132, 2011	94	2011
Effects of cobalt on the nucleation and grain refinement of Sn-3Ag-0.5 Cu solders ZL Ma, SA Belyakov, CM Gourlay Journal of Alloys and Compounds 682, 326-337, 2016	92	2016
The Influence of 0–0.1 wt.% Ni on the Microstructure and Fluidity Length of Sn-0.7Cu-xNi T Ventura, CM Gourlay, K Nogita, T Nishimura, M Rappaz, AK Dahle Journal of Electronic Materials 37, 32-39, 2008	91	2008
Kinetics of the η–η′ transformation in Cu6Sn5 K Nogita, CM Gourlay, SD McDonald, YQ Wu, J Read, QF Gu Scripta Materialia 65 (10), 922-925, 2011	87	2011
Evidence of the hydrogen release mechanism in bulk MgH₂ K Nogita, XQ Tran, T Yamamoto, E Tanaka, SD McDonald, CM Gourlay, ... Scientific reports 5 (1), 8450, 2015	84	2015
Nucleation of tin on the Cu6Sn5 layer in electronic interconnections JW Xian, ZL Ma, SA Belyakov, M Ollivier, CM Gourlay Acta Materialia 123, 404-415, 2017	80	2017
Harnessing heterogeneous nucleation to control tin orientations in electronic interconnections ZL Ma, SA Belyakov, K Sweatman, T Nishimura, CM Gourlay Nature Communications 8, 1916, 2017	75	2017
Anisotropic thermal expansion of Ni3Sn4, Ag3Sn, Cu3Sn, Cu6Sn5 and βSn JW Xian, G Zeng, SA Belyakov, Q Gu, K Nogita, CM Gourlay Intermetallics 91, 50-64, 2017	73	2017
Suppression of Cu6Sn5 in TiO2 reinforced solder joints after multiple reflow cycles MAAM Salleh, SD McDonald, CM Gourlay, H Yasuda, K Nogita Materials & Design 108, 418-428, 2016	73	2016
Engineering the Mg–Mg2Ni eutectic transformation to produce improved hydrogen storage alloys K Nogita, S Ockert, J Pierce, MC Greaves, CM Gourlay, AK Dahle International Journal of Hydrogen Energy 34 (18), 7686-7691, 2009	73	2009

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