| Ultra-thin embedded semiconductor device package and method of manufacturing thereof AV Gowda, PA McConnelee, SS Chauhan US Patent 9,806,051, 2017 | 161 | 2017 |
| Power overlay structure and method of making same AV Gowda, PA McConnelee, SS Chauhan US Patent 8,987,876, 2015 | 61 | 2015 |
| Embedded semiconductor device package and method of manufacturing thereof SS Chauhan, PA McConnelee, AV Gowda US Patent 9,391,027, 2016 | 43 | 2016 |
| Embedded semiconductor device package and method of manufacturing thereof SS Chauhan, PA McConnelee, AV Gowda US Patent 9,209,151, 2015 | 41 | 2015 |
| Power overlay structure and method of making same AV Gowda, PA McConnelee, SS Chauhan US Patent App. 15/601,735, 2017 | 38 | 2017 |
| Vertical interconnects for self shielded system in package (SiP) modules MC Lee, SS Chauhan, FP Carson, JC Hsu, TA Lin US Patent 9,721,903, 2017 | 38 | 2017 |
| Heat exchange assembly for use with electrical devices and methods of assembling an electrical device SE Weaver Jr, T Deng, HPJ De Bock, SS Chauhan US Patent 8,780,559, 2014 | 31 | 2014 |
| Thermal-fluid modeling for high thermal conductivity heat pipe thermal ground planes MT Ababneh, FM Gerner, P Chamarthy, P Bock, S Chauhan, T Deng Journal of Thermophysics and Heat Transfer 28 (2), 270-278, 2014 | 25 | 2014 |
| On the Charging and Thermal Characterization of a micro/nano structured Thermal Ground Plane HPJ de Bock, S Chauhan, P Chamarthy, SE Weaver, T Deng, FM Gerner, ... 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2010 | 24 | 2010 |
| Heat exchange assembly and methods of assembling same SS Chauhan, SE Weaver Jr, T Deng, CM Eastman, W Zhang US Patent 8,811,014, 2014 | 23 | 2014 |
| Diffusion barrier for surface mount modules AV Gowda, PA McConnelee, R Zhao, SS Chauhan US Patent 9,299,630, 2016 | 21 | 2016 |
| Probing thickness-dependent dislocation storage in freestanding Cu films using residual electrical resistivity S Chauhan, AF Bastawros Applied Physics Letters 93 (4), 041901, 2008 | 21 | 2008 |
| Self shielded system in package (SiP) modules MC Lee, SS Chauhan, FP Carson, JC Hsu, TA Lin US Patent 10,109,593, 2018 | 18 | 2018 |
| Substrate-less integrated components FP Carson, JC Hsu, MC Lee, SS Chauhan US Patent 10,535,611, 2020 | 16 | 2020 |
| Reliable surface mount integrated power module SS Chauhan, AV Gowda, PA McConnelee US Patent 8,941,208, 2015 | 16 | 2015 |
| Novel fluorescent visualization method to characterize transport properties in micro/nano heat pipe wick structures P Chamarthy, HPJ de Bock, B Russ, S Chauhan, B Rush, SE Weaver, ... International Electronic Packaging Technical Conference and Exhibition 43604 …, 2009 | 16 | 2009 |
| Charging station of a planar miniature heat pipe thermal ground plane MT Ababneh, S Chauhan, FM Gerner, D Hurd, P de Bock, T Deng Journal of heat transfer 135 (2), 021401, 2013 | 13 | 2013 |
| Electronics chassis and method of fabricating the same HPJ De Bock, SE Weaver Jr, T Deng, JT Labhart, P Chamarthy, ... US Patent 9,333,599, 2016 | 12 | 2016 |
| Development and experimental validation of a micro/nano thermal ground plane HPJ de Bock, S Chauhan, P Chamarthy, C Eastman, S Weaver, ... ASME/JSME Thermal Engineering Joint Conference 38921, T10249, 2011 | 11 | 2011 |
| System-in-package devices with magnetic shielding PR Sommer, S Pennathur, MC Lee, SS Chauhan, Y Chen US Patent 10,147,685, 2018 | 10 | 2018 |
Peter de BockDepartment of Energy - ARPA-eDirección de correo verificada de hq.doe.gov
