Chih-Ming Lin, Ph.D.

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Debbie G. Senesky, Ph.D.Associate Professor, Stanford UniversityDirección de correo verificada de stanford.edu
Jie ZouQualcomm, Resonant Inc. Skyworks Solutions, Inc., UC BerkeleyDirección de correo verificada de berkeley.edu
Ting-Ta Yen, Ernest YenUniversity of California at Berkeley - Texas InstrumentsDirección de correo verificada de ti.com
Matthew A HopcroftGeorge Washington, Cambridge, Stanford, Berkeley, Hewlett-PackardDirección de correo verificada de mems.stanford.edu
Dr. Jan H. KuypersIMTEK, Tohoku University, Berkeley, Sand 9, Qorvo, BlickfeldDirección de correo verificada de blickfeld.com
Wei-Cheng LienUniversity of California, BerkeleyDirección de correo verificada de berkeley.edu
Gongbin TangShandong UniversityDirección de correo verificada de sdu.edu.cn
Jin-Chen HsuNational Yunlin University of Science and TechnologyDirección de correo verificada de yuntech.edu.tw
Tsung-Tsong WuProfessor of Institute of Applied Mechanics, National Taiwan UniversityDirección de correo verificada de ntu.edu.tw
Jiansong LIUSkyworks Solutions Inc, CA; jiansong.liu@hotmail.com; jiansong.liu@ieee.orgDirección de correo verificada de jty.yuden.co.jp
Anming GaoUIUC, StarshineDirección de correo verificada de illinois.edu
Wei-Chang LiNational Taiwan UniversityDirección de correo verificada de iam.ntu.edu.tw
Andre GuedesCOO at Flomics BiotechDirección de correo verificada de flomics.com
Richard J. PrzybylaTDK Chirp Microsystems, Inc.Dirección de correo verificada de berkeley.edu
Bernhard BoserUC BerkeleyDirección de correo verificada de eecs.berkeley.edu
David A. HorsleyProfessor of Mechanical and Aerospace Engineering, University of California, DavisDirección de correo verificada de ucdavis.edu
Liwei LinProfessor of Mechanical Engineering, University of California at BerkeleyDirección de correo verificada de me.berkeley.edu
Yi (Frank) RaoGoertek, Rokid, Bandwidth10, University of California at Berkeley, Tsinghua UniversityDirección de correo verificada de goertek.com
Ventsislav YantchevQ-Arts Consulting Ltd., Bulgaria

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Chih-Ming Lin, Ph.D.

Broadcom, Skyworks, SiLabs, UC Berkeley

Dirección de correo verificada de berkeley.edu - Página principal

RF MEMS Acoustic Wave Devices Filter Design Transducers Acoustic Metamaterials


Título Ordenar por citas Ordenar por año Ordenar por título	Citado por Citado por	Año
Temperature-compensated aluminum nitride Lamb wave resonators CM Lin, TT Yen, YJ Lai, VV Felmetsger, MA Hopcroft, JH Kuypers, ... Ultrasonics, Ferroelectrics and Frequency Control, IEEE Transactions on 57 …, 2010	196	2010
AlN/3C–SiC composite plate enabling high‐frequency and high‐Q micromechanical resonators CM Lin, YY Chen, VV Felmetsger, DG Senesky, AP Pisano Advanced Materials 24 (20), 2722-2727, 2012	178	2012
Micromachined one-port aluminum nitride Lamb wave resonators utilizing the lowest-order symmetric mode CM Lin, V Yantchev, J Zou, YY Chen, AP Pisano Microelectromechanical Systems, Journal of 23 (1), 78-91, 2014	142	2014
Lamb wave loop circuit for acoustic wave filter CM Lin, J Zou, T Jibu, CS Lam, JJ Caron US Patent App. 16/287,802, 2019	137	2019
Thermally compensated aluminum nitride Lamb wave resonators for high temperature applications CM Lin, TT Yen, VV Felmetsger, MA Hopcroft, JH Kuypers, AP Pisano Applied Physics Letters 97 (8), 083501, 2010	136	2010
Intrinsic temperature compensation of aluminum nitride Lamb wave resonators for multiple-frequency references JH Kuypers, CM Lin, G Vigevani, AP Pisano Frequency Control Symposium (FCS), 2008 IEEE International, 240-249, 2008	116	2008
Temperature sensor based on 4H-silicon carbide pn diode operational from 20 °C to 600 °C N Zhang, CM Lin, DG Senesky, AP Pisano Applied Physics Letters 104 (7), 073504, 2014	115	2014
High-Q aluminum nitride Lamb wave resonators with biconvex edges CM Lin, YJ Lai, JC Hsu, YY Chen, DG Senesky, AP Pisano Applied Physics Letters 99 (14), 143501, 2011	103	2011
AlN thin films grown on epitaxial 3C–SiC (100) for piezoelectric resonant devices CM Lin, WC Lien, VV Felmetsger, MA Hopcroft, DG Senesky, AP Pisano Applied Physics Letters 97 (14), 141907, 2010	95	2010
Transducer design for AlN Lamb wave resonators J Zou, CM Lin, CS Lam, AP Pisano Journal of Applied Physics 121 (15), 2017	84	2017
Surface acoustic wave devices on AlN/3C–SiC/Si multilayer structures CM Lin, YY Chen, VV Felmetsger, WC Lien, T Riekkinen, DG Senesky, ... Journal of Micromechanics and Microengineering 23 (2), 025019, 2013	83	2013
The multi-mode resonance in AlN Lamb wave resonators J Zou, CM Lin, A Gao, AP Pisano Journal of Microelectromechanical Systems 27 (6), 973-984, 2018	70	2018
Anchor loss reduction in AlN Lamb wave resonators using phononic crystal strip tethers CM Lin, JC Hsu, DG Senesky, AP Pisano Frequency Control Symposium (FCS), 2014 IEEE International, 371-375, 2014	69	2014
High-Q Butterfly-Shaped AlN Lamb Wave Resonators J Zou, CM Lin, G Tang, AP Pisano IEEE Electron Device Letters 38 (12), 1739-1742, 2017	61	2017
Theoretical investigation of Lamb wave characteristics in AlN/3C–SiC composite membranes CM Lin, YY Chen, AP Pisano Applied Physics Letters 97 (19), 193506, 2010	51	2010
Theoretical study of thermally stable SiO2/AlN/SiO2 Lamb wave resonators at high temperatures J Zou, CM Lin, YY Chen, AP Pisano Journal of Applied Physics 115 (9), 2014	50	2014
Quality factor enhancement in Lamb wave resonators utilizing butterfly-shaped AlN plates J Zou, CM Lin, AP Pisano 2014 IEEE International Ultrasonics Symposium, 81-84, 2014	38	2014
Characteristics of AlN Lamb wave resonators with various bottom electrode configurations CM Lin, V Yantchev, YY Chen, VV Felmetsger, AP Pisano IEEE International Frequency Control Symposium and European Frequency and …, 2011	32	2011
Characterization of aluminum nitride Lamb wave resonators operating at 600°C for harsh environment RF applications TT Yen, CM Lin, X Zhao, VV Felmetsger, DG Senesky, MA Hopcroft, ... Micro Electro Mechanical Systems (MEMS), 2010 IEEE 23rd International …, 2010	30	2010
Two-port filters and resonators on AlN/3C-SiC plates utilizing high-order Lamb wave modes CM Lin, YY Chen, VV Felmetsge, DG Senesky, AP Pisano 2013 IEEE 26th International Conference on Micro Electro Mechanical Systems …, 2013	28	2013

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