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Co-authors
Branislav HredzakAssoc. Professor, School of Electrical Engineering and Telecommunications, UNSW SydneyVerified email at unsw.edu.au
Ben M. ChenChinese University of Hong Kong (CUHK), NUS, SUNY at Stony Brook, Washington State University (WSU)Verified email at ieee.org
T. H. LeeProfessor of Electrical and Computer Engineering, National University of SingaporeVerified email at nus.edu.sg
Wei GuoMolex, Western Digital, HGST, Maxtor, DSIVerified email at molex.com
Chee Khiang Pang (Justin)Editor-in-Chief, Transactions of the Institute of Measurement and ControlVerified email at ieee.org
Abhishek DhandaCamera Systems, AppleVerified email at stanfordalumni.org
Guido HerrmannUniversity of ManchesterVerified email at manchester.ac.uk
Lihua XieProfessor of Electrical Engineering, Nanyang Technological UniversityVerified email at ntu.edu.sg
Jinchuan ZhengProfessor of Robotics and Mechatronics, Swinburne University of Technology, MelbourneVerified email at swin.edu.au
David John HILLProfessor of Power and Energy Systems, Monash University and Emeritus, University of SydneyVerified email at monash.edu
Abdullah Al MamunAssoc. Prof. of Electrical & Computer Engineering, National University of SingaporeVerified email at nus.edu.sg
Sam GeNational University of SingaporeVerified email at nus.edu.sg
Matthew C. TurnerUniversity of SouthamptonVerified email at soton.ac.uk
Ian PostlethwaiteNewcastle UniversityVerified email at newcastle.ac.uk
F.L. Lewisprofessor of electrical engineering, The University of Texas at ArlingtonVerified email at uta.edu
S. Craig SmithWestern Digital CorporationVerified email at wdc.com
Daqing Zhang, IEEE FellowChair Professor, Telecom SudParis/Peking UniversityVerified email at telecom-sudparis.eu
Minghui ZhengJ. Mike Walker '66 Department of Mechanical Engineering, Texas A&M UniversityVerified email at tamu.edu
Masayoshi TomizukaMechaniccal Engineering, University of CaliforniaVerified email at me.berkeley.edu
Min XieChair Professor of Industrial Engineering, City University of Hong KongVerified email at cityu.edu.hk