System on package R Tummala McGraw-Hill Professional, 2008 | 305* | 2008 |
Nanopackaging: Nanotechnologies and electronics packaging JE Morris Nanopackaging: Nanotechnologies and Electronics Packaging, 1-44, 2018 | 146 | 2018 |
Study of edge effect and multi-curvature in laser bending of AISI 304 stainless steel GC Jha, AK Nath, SK Roy Journal of Materials Processing Technology 197 (1-3), 434-438, 2008 | 39 | 2008 |
Coelectrodeposited solder composite films for advanced thermal interface materials PM Raj, PR Gangidi, N Nataraj, N Kumbhat, GC Jha, R Tummala, N Brese IEEE Transactions on Components, Packaging and Manufacturing Technology 3 (6 …, 2013 | 13 | 2013 |
Effect of deposition temperature on the microstructure and electrical properties of Ba0.8Sr0.2TiO3 thin films deposited by radio-frequency magnetron sputtering GC Jha, SK Ray, I Manna Thin Solid Films 516 (10), 3416-3421, 2008 | 13 | 2008 |
Effect of annealing temperature on the structural and electrical properties of SrBi2Ta2O9 thin films for memory-based applications G Jha, A Roy, A Dhar, I Manna, SK Ray Physica B: Condensed Matter 400 (1), 33-37, 2007 | 13 | 2007 |
Electronic packaging with a variable thickness mold cap CJ Healy, GC Jha, V Ramadoss US Patent 8,753,926, 2014 | 12 | 2014 |
Through mold via relief gutter on molded laser package (MLP) packages CJ Healy, GC Jha, M Aldrete US Patent 9,313,881, 2016 | 8 | 2016 |
Co-electrodeposited graphite and diamond-loaded solder nanocomposites as thermal interface materials GP Reddy, PM Raj, N Nataraj, PM Rajesh, G Jha, A Choudhury, ... 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC …, 2010 | 7 | 2010 |
Low-temperature, fine-pitch interconnections using self-patternable metallic nanoparticles as the bonding layer G Mehrotra, G Jha, JD Goud, PM Raj, M Venkatesan, M Iyer, D Hess, ... 2008 58th Electronic Components and Technology Conference, 1410-1416, 2008 | 6 | 2008 |
A novel electroless process for embedding a thin film resistor on the benzocyclobutene dielectric SK Bhattacharya, MG Varadarajan, P Chahal, GC Jha, RR Tummala Journal of electronic materials 36, 242-244, 2007 | 6 | 2007 |
Hybrid Multilayer Substrate V Ramadoss, GC Jha, CJ Healy, Q INCORPORATED US Patent 8546921, 2,013, 2010 | 3 | 2010 |
Nanogranular Magnetic Core Inductors: Design, Fabrication, and Packaging GC Jha, SK Bhattacharya, RR Tummala Nanopackaging: Nanotechnologies and Electronics Packaging, 163-188, 2008 | 1 | 2008 |
Low Temperature (≪100°C) deposited pyrochlore films with high capacitance (200 nF/cm2), low loss (∼0.003) and low TCF (≪100 ppm/C) for integrating RF … PM Raj, JH Hwang, HM Jung, M Kumar, G Jha, K Coulter, S Wellinghoff, ... 2008 58th Electronic Components and Technology Conference, 688-693, 2008 | 1 | 2008 |
Inductors: Micro-to Nanoscale Embedded Thin Power Inductors PM Raj, GC Jha, S Teng, H Sharma, SK Bhattacharya, RR Tummala Nanopackaging: Nanotechnologies and Electronics Packaging, 311-343, 2018 | | 2018 |
Electrical properties of SrBi {sub 2} Ta {sub 2} O {sub 9} thin films deposited on Si (100) substrates by rf magnetron sputtering A Roy, G Jha, A Dhar, SK Ray, I Manna Indian Journal of Engineering and Materials Sciences 15, 2008 | | 2008 |
Effect of deposition temperature on the microstructure and electrical properties of Ba {sub 0.8} Sr {sub 0.2} TiO {sub 3} thin films deposited by radio-frequency magnetron … GC Jha, SK Ray, I Manna Thin Solid Films 516, 2008 | | 2008 |
Copper to copper bonding by nano interfaces for fine pitch interconnections and thermal applications GC Jha Georgia Institute of Technology, 2008 | | 2008 |
Electrical properties of SrBi₂Ta₂O₉ thin films deposited on Si (100) substrates by rf magnetron sputtering A Roy, G Jha, A Dhar, I Manna, SK Ray CSIR, 2008 | | 2008 |
Effect of annealing temperature on the structural and electrical properties of SrBi {sub 2} Ta {sub 2} O {sub 9} thin films for memory-based applications G Jha, A Roy, A Dhar, I Manna, SK Ray Physica. B, Condensed Matter 400, 2007 | | 2007 |