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Co-authors
- Zhengbao YANGAssociate Professor, Hong Kong University of Science and TechnologyVerified email at ust.hk
- Shiyuan LIU (刘世源)Hong Kong University of Science and TechnologyVerified email at my.cityu.edu.hk
- Zhuomin ZHANG (张卓敏)City University of Hong Kong, Hong Kong University of Science and TechnologyVerified email at my.cityu.edu.hk
- Chuan-Fei Guo (郭传飞)Southern University of Science and Technology (SUSTech)Verified email at sustech.edu.cn
- Yao (Neil) ShanThe Hong Kong University of Science and TechnologyVerified email at my.cityu.edu.hk
- Weikang LinCity University of Hong KongVerified email at my.cityu.edu.hk
- Lihan JinCity University of Hong KongVerified email at my.cityu.edu.hk
- Xiaowei Luo, Ph.D., M.ASCE, M.ASMEAssociate Professor, Architecture and Civil Engineering, City University of Hong KongVerified email at cityu.edu.hk
- Junlong Yang(杨俊龙)Sichuan University, Southern University of Science and TechnologyVerified email at scu.edu.cn
- Jun HuangPhD student, The Hong Kong University of Science and TechnologyVerified email at connect.ust.hk
- Qi WangThe Hong Kong University of Science and TechnologyVerified email at connect.ust.hk
- Haojian LUZhejiang UniversityVerified email at zju.edu.cn
- Yajing Shen (申亚京)The Hong Kong University of Science and TechnologyVerified email at ust.hk
- Zhihe LONG (龙之河)University of Electronic Science and Technology of ChinaVerified email at uestc.edu.cn