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Oliver G SchmidtScientific Director, Research Center MAIN at TU Chemnitz, Adjunct Professor at TU DresdenVerified email at etit.tu-chemnitz.de
Yongfeng MeiFudan UniversityVerified email at fudan.edu.cn
Zhaowei LiuUniversity of California San DiegoVerified email at ucsd.edu
Suwit KiravittayaDepartment of Electrical Engineering, Faculty of Engineering, Chulalongkorn UniversityVerified email at chula.ac.th
Yeon Ui LeeChungbuk National UniversityVerified email at cbnu.ac.kr
Yin YinIFW DresdenVerified email at ifw-dresden.de
Stefan BöttnerX-FAB Dresden GmbH & Co. KGVerified email at xfab.com
Haoliang QianZhejiang UniversityVerified email at zju.edu.cn
Prof. Dr. V. M. FominInstitute for Emerging Electronic Technologies, Leibniz IFW Dresden & Moldova State UniversityVerified email at usm.md
Sile NIC CHORMAICProfessor, Okinawa Institute of Science and Technology Graduate UniversityVerified email at oist.jp
Ziao TianShanghai Institute of Microsystem And Information TechnologyVerified email at mail.sim.ac.cn
Jiawei WangHITSZ, IFW Dresden, TU Chemnitz, HKUSTVerified email at hit.edu.cn
Ke TianHarbin Engineering UniversityVerified email at hrbeu.edu.cn
Mohammed Zia JalaludeenPhD Student, Okinawa Institute of Science and TechnologyVerified email at oist.jp
Hongsheng ChenProfessor of Electromagnetics Academy, Zhejiang UniversityVerified email at zju.edu.cn
Sihan ZhaoDepartment of Physics, Zhejiang UniversityVerified email at zju.edu.cn
Vladimir A. Bolaños QuiñonesSemiconductor Industry