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- Gang WangNingbo UniversityVerified email at nbu.edu.cn
- Yongfeng MeiFudan UniversityVerified email at fudan.edu.cn
- Sheng BiDalian University of TechnologyVerified email at dlut.edu.cn
- Paul K ChuChair Professor of Materials Engineering, City University of Hong KongVerified email at cityu.edu.hk
- ENMING SONGFudan UniversityVerified email at fudan.edu.cn
- John A. RogersSimpson/Querrey Professor, Northwestern UniversityVerified email at northwestern.edu
- Xh Zheng中国科学院上海位系统与信息技术研究所Verified email at mail.sim.ac.cn
- Shiwei TangAssociate Professor, School of Physical Science and Technology, Ningbo UniversityVerified email at nbu.edu.cn
- Xinge YuAssociate Professor of Biomedical Engineering, City University of Hong KongVerified email at cityu.edu.hk
- Xin NingAssistant Professor of Aerospace Engineering; University of Illinois at Urbana-ChampaignVerified email at illinois.edu
- Hao Zhang (张昊)Department of Chemistry, Tsinghua UniversityVerified email at mail.tsinghua.edu.cn
- Jahyun KooAssociate Professor, Korea UniversityVerified email at korea.ac.kr
- Li ZhengShanghai Institute of Microsystem and Information Technology, Chinese Academy of SciencesVerified email at mail.sim.ac.cn
- Ziao TianShanghai Institute of Microsystem And Information TechnologyVerified email at mail.sim.ac.cn
- Jan-Kai ChangCenter for Bio-Integrated Electronics, Northwestern UniversityVerified email at northwestern.edu
- GaoShan HuangProfessor, Fudan UniversityVerified email at fudan.edu.cn
- Zhaoqian XieProfessor of Engineering Mechanics, Dalian University of TechnologyVerified email at dlut.edu.cn
- Zengfeng DiShanghai Institute of Microsystem And Information Technology