| Microelectronics Packaging Handbook: Technology Drivers Part I RR Tummala, EJ Rymaszewski, AG Klopfenstein Springer Science & Business Media, 2012 | 2545 | 2012 |
| Fundamentals of Microsystems Packaging RR Tummala McGraw-Hill, 2001 | 1499 | 2001 |
| Ceramic and glass‐ceramic packaging in the 1990s RR Tummala Journal of the American Ceramic Society 74 (5), 895-908, 1991 | 1025 | 1991 |
| ZnO nanobelt/nanowire Schottky diodes formed by dielectrophoresis alignment across Au electrodes CS Lao, J Liu, P Gao, L Zhang, D Davidovic, R Tummala, ZL Wang Nano Letters 6 (2), 263-266, 2006 | 467 | 2006 |
| A review of SiC power module packaging technologies: Challenges, advances, and emerging issues H Lee, V Smet, R Tummala IEEE Journal of Emerging and Selected Topics in Power Electronics 8 (1), 239-255, 2019 | 372 | 2019 |
| SOP: what is it and why? A new microsystem-integration technology paradigm-Moore's law for system integration of miniaturized convergent systems of the next decade RR Tummala IEEE Transactions on Advanced Packaging 27 (2), 241-249, 2004 | 356 | 2004 |
| System on package R Tummala McGraw-Hill Professional, 2008 | 304* | 2008 |
| Wearable systems for health care applications P Lukowicz, T Kirstein, G Tröster Methods of information in medicine 43 (03), 232-238, 2004 | 296 | 2004 |
| Next generation integral passives: materials, processes, and integration of resistors and capacitors on PWB substrates SK Bhattacharya, RR Tummala Journal of Materials Science: Materials in Electronics 11, 253-268, 2000 | 289 | 2000 |
| RF-system-on-package (SOP) for wireless communications K Lim, S Pinel, M Davis, A Sutono, CH Lee, D Heo, A Obatoynbo, J Laskar, ... IEEE Microwave magazine 3 (1), 88-99, 2002 | 262 | 2002 |
| Low-cost thin glass interposers as a superior alternative to silicon and organic interposers for packaging of 3-D ICs V Sukumaran, T Bandyopadhyay, V Sundaram, R Tummala IEEE Transactions on Components, Packaging and Manufacturing Technology 2 (9 …, 2012 | 250 | 2012 |
| Failure mechanisms and optimum design for electroplated copper through-silicon vias (TSV) X Liu, Q Chen, P Dixit, R Chatterjee, RR Tummala, SK Sitaraman 2009 59th Electronic components and technology conference, 624-629, 2009 | 220 | 2009 |
| A review of 5G front-end systems package integration AO Watanabe, M Ali, SYB Sayeed, RR Tummala, MR Pulugurtha IEEE Transactions on Components, Packaging and Manufacturing Technology 11 …, 2020 | 200 | 2020 |
| The SOP for miniaturized, mixed-signal computing, communication, and consumer systems of the next decade RR Tummala, M Swaminathan, MM Tentzeris, J Laskar, GK Chang, ... IEEE Transactions on Advanced Packaging 27 (2), 250-267, 2004 | 186 | 2004 |
| Carrier density and Schottky barrier on the performance of DC nanogenerator J Liu, P Fei, J Song, X Wang, C Lao, R Tummala, ZL Wang Nano letters 8 (1), 328-332, 2008 | 183 | 2008 |
| System on chip or system on package? RR Tummala, VK Madisetti IEEE Design & Test of Computers 16 (2), 48-56, 1999 | 173 | 1999 |
| Glass-ceramic structures and sintered multilayer substrates thereof with circuit patterns of gold, silver or copper AH Kumar, PW McMillan, RR Tummala US Patent 4,301,324, 1981 | 167 | 1981 |
| Integral passives for next generation of electronic packaging: application of epoxy/ceramic nanocomposites as integral capacitors SK Bhattacharya, RR Tummala Microelectronics Journal 32 (1), 11-19, 2001 | 164 | 2001 |
| A novel integrated decoupling capacitor for MCM-L technology P Chahal, RR Tummala, MG Allen, M Swaminathan IEEE Transactions on Components, Packaging, and Manufacturing Technology …, 1998 | 164 | 1998 |
| Multilayered glass-ceramic substrate for mounting of semiconductor device B Narken, RR Tummala US Patent 4,221,047, 1980 | 155 | 1980 |
