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Pulugurtha Markondeya raj
Pulugurtha Markondeya raj
Florida International University
Verified email at ece.gatech.edu
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Cited by
Year
The SOP for miniaturized, mixed-signal computing, communication, and consumer systems of the next decade
RR Tummala, M Swaminathan, MM Tentzeris, J Laskar, GK Chang, ...
IEEE Transactions on Advanced Packaging 27 (2), 250-267, 2004
1862004
A review of 5G front-end systems package integration
AO Watanabe, M Ali, SYB Sayeed, RR Tummala, MR Pulugurtha
IEEE Transactions on Components, Packaging and Manufacturing Technology 11 …, 2020
1562020
Nanopackaging: Nanotechnologies and electronics packaging
JE Morris
Nanopackaging: Nanotechnologies and Electronics Packaging, 1-44, 2018
1432018
Colloidal processing of polymer ceramic nanocomposite integral capacitors
H Windlass, PM Raj, D Balaraman, SK Bhattacharya, RR Tummala
IEEE transactions on electronics packaging manufacturing 26 (2), 100-105, 2003
1262003
Anisotropic shrinkage in tape‐cast alumina: Role of processing parameters and particle shape
PM Raj, WR Cannon
Journal of the American Ceramic Society 82 (10), 2619-2625, 1999
1021999
2005 IEEE 55th Electronic Components and Technology Conference
Institute of Electrical and Electronics Engineers, Inc. Staff
IEEE, 2005
90*2005
Polymer-ceramic nanocomposite capacitors for system-on-package (SOP) applications
H Windlass, PM Raj, D Balaraman, SK Bhattacharya, RR Tummala
IEEE transactions on advanced packaging 26 (1), 10-16, 2003
792003
Anisotropic shrinkage during sintering of particle-oriented systems—numerical simulation and experimental studies
PM Raj, A Odulena, WR Cannon
Acta materialia 50 (10), 2559-2570, 2002
782002
Trend from ICs to 3D ICs to 3D systems
RR Tummala, V Sundaram, R Chatterjee, PM Raj, N Kumbhat, ...
2009 IEEE Custom Integrated Circuits Conference, 439-444, 2009
682009
First demonstration of compact, ultra-thin low-pass and bandpass filters for 5G small-cell applications
M Ali, F Liu, A Watanabe, PM Raj, V Sundaram, MM Tentzeris, ...
IEEE Microwave and Wireless Components Letters 28 (12), 1110-1112, 2018
652018
Magneto-dielectric nanocomposite for antenna miniaturization and SAR reduction
K Han, M Swaminathan, R Pulugurtha, H Sharma, R Tummala, S Yang, ...
IEEE Antennas and Wireless Propagation Letters 15, 72-75, 2015
542015
Antenna miniaturization using magneto-dielectric substrates
N Altunyurt, M Swaminathan, PM Raj, V Nair
2009 59th Electronic Components and Technology Conference, 801-808, 2009
512009
Ultrathin antenna-integrated glass-based millimeter-wave package with through-glass vias
AO Watanabe, TH Lin, M Ali, Y Wang, V Smet, PM Raj, MM Tentzeris, ...
IEEE Transactions on Microwave Theory and Techniques 68 (12), 5082-5092, 2020
462020
Copper interconnections for high performance and fine pitch flip chip digital applications and ultra-miniaturized RF module applications
RR Tummala, PM Raj, A Aggarwal, G Mehrotra, SW Koh, S Bansal, ...
56th Electronic Components and Technology Conference 2006, 10 pp., 2006
422006
Highly-reliable, 30µm pitch copper interconnects using nano-ACF/NCF
N Kumbhat, A Choudhury, M Raine, G Mehrotra, PM Raj, R Zhang, ...
2009 59th Electronic Components and Technology Conference, 1479-1485, 2009
392009
First demonstration of 28 GHz and 39 GHz transmission lines and antennas on glass substrates for 5G modules
AO Watanabe, M Ali, B Tehrani, J Hester, H Matsuura, T Ogawa, PM Raj, ...
2017 IEEE 67th Electronic Components and Technology Conference (ECTC), 236-241, 2017
382017
Broadband and miniaturized antenna-in-package (AiP) design for 5G applications
TH Lin, K Kanno, AO Watanabe, PM Raj, RR Tummala, M Swaminathan, ...
IEEE Antennas and Wireless Propagation Letters 19 (11), 1963-1967, 2020
372020
Mid frequency decoupling using embedded decoupling capacitors
P Muthana, M Swaminathan, E Engin, PM Raj, R Tummala
IEEE 14th Topical Meeting on Electrical Performance of Electronic Packaging …, 2005
362005
Magnetic nanocomposites for organic compatible miniaturized antennas and inductors
PM Raj, P Muthana, TD Xiao, L Wan, D Balaraman, IR Abothu, ...
Proceedings. International Symposium on Advanced Packaging Materials …, 2005
342005
Miniaturized high-performance filters for 5G small-cell applications
M Ali, F Liu, A Watanabe, PM Raj, V Sundaram, MM Tentzeris, ...
2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 1068-1075, 2018
332018
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